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Utech Electronics - Press Release

Fujipoly Product Highlight - Fujipoly SARCON® SPG-30B

Fujipoly  

Form-in-Place TIM Fills Large Gap

SARCON® SPG-30B from Fujipoly® is a new form-in-place thermal gap filler that eliminates performance-hindering air gaps ranging from .08mm to 1.0mm. SPG-30B delivers a superior thermal conductivity of 3.1 W/m°K with a thermal resistance of only 0.33°Cin2/W.

The ultra-low compression force silicone compound completely fills all spaces, gaps and protrusions when compressed between a heat source and a nearby heat sink or spreader. The material is easy to apply and does not require heat curing. This Fujipoly® TIM also exhibits excellent vibration absorption and electrical insulation properties.

The form stable thermal compound will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40C to + 150C). SARCON® SPG-30B is available in 30ml pre-filled syringes or 325ml cartridges.

 



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